Samsung Electronics and Broadcom have signed a memorandum of understanding to expand their strategic collaboration across memory, foundry and advanced packaging, a partnership the companies say will represent more than $200 billion of activity over the next five years through 2030. The pact, unveiled during Broadcom's AI Summit at The Midway in San Francisco, cements Samsung as a core supplier for Broadcom's custom AI accelerator roadmap.
2nm Foundry And Advanced Packaging
Under the MOU, Samsung will manufacture Broadcom silicon on its 2-nanometer process and below, including workloads for Broadcom's Wireless Broadband Communications solutions and next-generation AI networking silicon. The agreement also extends to Samsung's 2.3D and 2.5D advanced packaging built on 2nm, giving Broadcom a one-stop path from wafers to system-in-package for hyperscaler orders.
Memory And HBM Supply Locked In
The memory portion of the collaboration secures HBM and other advanced DRAM capacity for Broadcom's growing lineup of AI ASICs and networking chips. Samsung is racing to catch SK hynix and Micron on HBM3E and HBM4 qualifications with hyperscalers, and the deal gives Samsung a large anchor customer as it ramps its Pyeongtaek and Hwaseong lines. 
Broadcom's AI Chip Playbook
Broadcom has been arranging more than $60 billion of senior debt for its AI chip pipeline with Anthropic and other hyperscalers, a financing plan that requires reliable leading-edge silicon and memory at scale. The Samsung MOU tightens that supply chain and complements Broadcom's Apple ASIC collaboration through 2031. Samsung already has separate 4nm and 5nm price hikes tied to AI demand in effect, underscoring how tight capacity has become.
Korea's Foundry Push
Senior Korean government officials attended the signing alongside Jinman Han, president of Samsung Foundry, and Hock Tan, Broadcom's chief executive. Seoul has been ramping its own $3.5 billion semiconductor support fund for materials, fabless design houses and fab expansion, and the Broadcom deal is a marquee validation of that industrial policy. It also arrives as Samsung Electronics unveiled a $72 billion shareholder return program on the back of the AI chip boom.
Reporting based on coverage from Samsung Semiconductor Global, CNBC, Fortune and eeNews Europe.