Latest Kinsus Interconnect Technology news, funding rounds and robotics & AI coverage. 1 article tracked by The Robotics Media.
Kinsus Interconnect Technology Corp. (TWSE: 3189) is a Taiwan-based advanced IC substrate manufacturer established in 2000 and headquartered in Taoyuan City. The company designs and produces plastic ball-grid-array, flip-chip chip-scale-package and ABF substrates used to house microprocessors, GPUs, ASICs and PC chipsets.
A member of the Pegatron group, Kinsus is one of Taiwan's three dominant substrate fabricators alongside Unimicron and Nan Ya PCB. Its ABF capacity expansions in 2022 and 2023 positioned the company to serve the AI server buildout, and in July 2026 the firm was named as TSMC's co-development partner on an EMIB-like advanced packaging program.