Amkor Technology (Nasdaq: AMKR) on September 8, 2026 unveiled Phase 2 of its Arizona Advanced Packaging and Test Campus in Peoria, adding roughly 60,000 square meters of cleanroom and pushing planned investment from about $7 billion to approximately $12 billion. The world's largest US-based OSAT provider paired the announcement with a new multi-year strategic partnership with NVIDIA, which will prepay for capacity to secure advanced 2.5D/3D packaging supply for its next-generation AI accelerators.
Phase 2: from 33,000 to 93,000 m² of cleanroom
Amkor said customer commitments have already surpassed the 33,000 square meters of cleanroom capacity originally planned for Phase 1, forcing the company to accelerate a second phase that was baked into the site plan from day one. Phase 2 brings the 170-acre campus to about 93,000 square meters and lifts the projected headcount above 3,500 Arizona-based employees. Construction is scheduled to begin in late 2027 and complete by end-2029, with the campus offering wafer bump, probe, assembly and test in a full domestic turnkey stack.
"This next phase reflects the confidence our customers have placed in Amkor, the critical role advanced packaging plays in enabling the future of semiconductor innovation, and the strategic importance of our Arizona campus," said Kevin Engel, president and CEO of Amkor Technology.
NVIDIA prepayment secures advanced-packaging capacity
Under the strategic partnership, NVIDIA will make a prepayment supporting Amkor's expansion of US advanced-packaging capacity. The two companies will align long-term roadmaps on high-density interconnects and next-generation heterogeneous integration for data-center processors, networking chipsets and accelerated computing platforms. Amkor already supplies advanced packaging for a broad range of NVIDIA products.
"AI is driving a generational shift in technology, transforming every industry and creating a unique opportunity to reinvigorate American manufacturing and supply chains," said Debora Shoquist, executive vice president of operations at NVIDIA.
Positioning the US OSAT stack next to TSMC's fabs
The Peoria campus sits in the Innovation Core near TSMC's Arizona fabs, giving customers a first-of-its-kind domestic OSAT loop for high-volume advanced packaging on US soil. The move reinforces a US supply chain that is racing to add capacity as sovereign AI compute demand rises. It also tracks with other recent US semiconductor build-outs covered by The Robotics Media, including NVIDIA and Amkor's initial $1.5 billion Arizona commitment in July, Meta's 14 GW MTIA v3 Iris chip build-out with Broadcom and TSMC, and Microsoft's 38-gigawatt data-center plan through 2032.
Reporting based on coverage from Amkor Technology investor relations, Business Wire and AZ Big Media.