SEMICON India 2026 opened on September 17 at Yashobhoomi in New Delhi with roughly ₹1 lakh crore in fresh investment commitments, 11 memoranda of understanding and a $13.5 billion Phase 2 outlay for the India Semiconductor Mission, cementing India's push from packaging to design and materials.
Semicon 2.0 Widens The Mission
Union Electronics Minister Ashwini Vaishnaw unveiled Semicon 2.0, a $13.5 billion (₹1,27,500 crore) programme that widens New Delhi's chip strategy beyond fabs to six pillars: design, machines and materials, fabrication, advanced packaging, applied R&D and talent. Prime Minister Narendra Modi told the plenary that "India's semiconductor ecosystem is expanding rapidly. It is opening new opportunities for innovation, investment and growth."
Officials said the day's ₹1 lakh crore in pledges is expected to translate into some 100,000 new jobs over two to three years, layered on top of the earlier ₹76,000 crore Phase 1 outlay under which twelve projects have already been approved and three are in commercial production.
Tata Electronics Anchors Eleven MoUs
The edge-AI and packaging themes dominated the day's paperwork. Tata Electronics signed five MoUs, headlined by a wafer-manufacturing, assembly, testing and technology-collaboration pact with Dutch discrete-semiconductor giant Nexperia, and a 363-acre vendor-park lease with Ascendas First Space in Dholera, Gujarat. Fujifilm and JSR agreed to localise critical fab chemicals and photoresists with Tata, while BESI Singapore signed on to bring advanced packaging know-how.
Design And Packaging Take Centre Stage
Kaynes Semicon inked deals with three design-services partners — OptoML India, GridCrist Technologies and Sensesemi — for advanced packaging and assembly, and CDIL Semiconductors announced commercial production with Japan's Shindengen Electric Manufacturing. Suchi Semicon and eInfochips said they had completed their first commercial device batch exchange, showing that domestic OSAT flows are starting to close the loop.
Talent, Design And ChipIN
Beyond hardware, Intel India launched an "Introduction to Semiconductors" course with the India Semiconductor Mission, and a separate deal with the New Age Makers' Institute focused on training a workforce in AI and semiconductors. The government said six new ChipIN Regional Centres, 400 university partnerships and a five-year plan to train 100,000 technicians would underpin the talent pillar.
Coverage from earlier this month showed similar momentum across the Asian chip corridor with Semicon Taiwan 2026, and the Analog Devices–Alif deal underscored the same shift toward edge-AI silicon that Modi highlighted from the SEMICON India stage.
Reporting based on coverage from ANI, Business Today, Bloomberg and the Government of India.