Taiwan Semiconductor Manufacturing Company (TSMC) News
Latest Taiwan Semiconductor Manufacturing Company (TSMC) news, funding rounds and robotics & AI coverage. 20 articles tracked by The Robotics Media.
About Taiwan Semiconductor Manufacturing Company (TSMC)
Taiwan Semiconductor Manufacturing Company (TSMC) is a pure-play semiconductor foundry that manufactures integrated circuits designed by other companies, rather than selling chips under its own brand. It was founded in 1987 in Hsinchu, Taiwan, pioneering the foundry business model that separates chip design from chip fabrication.
TSMC operates fabrication plants in Taiwan, the United States (Arizona), Japan, and China, with a specialty fab under construction in Germany. It produces chips across a range of process nodes, from mature nodes down to its most advanced N3 and N2 (2-nanometer) nodes, with the next-generation A16 (1.6-nanometer) node targeted for volume production around 2027. Its advanced packaging technologies include CoWoS and SoIC, marketed together under the 3DFabric name.
The company manufactures chips for customers including Apple, Nvidia, AMD, Qualcomm, and Broadcom, serving markets such as smartphones, high-performance computing, AI accelerators, and automotive electronics. TSMC is listed on the Taiwan Stock Exchange and, via American Depositary Receipts, on the New York Stock Exchange.
Key facts
- Headquarters: Hsinchu, Hsinchu Science Park, Taiwan
- Country: Taiwan
- Founded: 1987
- Employees: 50,001-100,000
- Ownership: Publicly traded (NYSE: TSM)
- Sectors: Semiconductors
- Website: https://www.tsmc.com
Products by Taiwan Semiconductor Manufacturing Company (TSMC)
- A16 (Service) — TSMC's next-generation 1.6-nanometer-class process node featuring Super Power Rail backside power delivery, targeted for volume production around 2027.
- N2 (Service, 2025) — TSMC's 2-nanometer-class logic process node using gate-all-around nanosheet transistors, in volume production from 2025.
- N3 (Service, 2022) — TSMC's 3-nanometer-class FinFET logic process node used for products such as Apple's A-series and M-series chips.
- 3DFabric (Service) — TSMC's family of 3D silicon stacking and advanced packaging technologies, including CoWoS and SoIC, used for chiplet and AI accelerator designs.
Latest Taiwan Semiconductor Manufacturing Company (TSMC) news
- Siemens And TSMC Deepen AI Chip Design Pact, Add DRC Fixing Agent For N2 And A16 — Siemens and TSMC extended their Open Innovation Platform tie-up on September 23, 2026 with a joint AI-powered DRC fixing agent and expanded Calibre, A...
- TSMC Sets 3-6% Wafer Price Hike For 2027 As AI Orders Face 21% Bill — TSMC has told customers wafer-out prices will rise 3-6% from January 2027, with an additional 10-15% HPC surcharge on AI overflow orders that could pu...
- MediaTek Debuts 2nm Dimensity 9600 Pro, Claims 61% Lower Multi-Core Power — MediaTek's first 2nm SoC lands with a 2+3+3 all-big-core CPU, dual-NPU AI engine and 55% higher tokens-per-watt for on-device LLMs.
- Alchip Rolls Out 2nm ASIC and 3DIC Platform at AI Infra Summit — Taiwan's Alchip Technologies used the AI Infra Summit to showcase a 2nm ASIC design platform, 3nm I/O chiplets and a complete 3DIC ecosystem built on...
- Meta Puts MTIA v3 'Iris' Custom AI Chip Into Production This Month — Meta has begun production of its third-generation MTIA 'Iris' AI accelerator this September, a Broadcom-designed, TSMC 3nm chip meant to double the co...
- Semicon Taiwan 2026 Opens With Silicon Photonics And Co-Packaged Optics In The Spotlight — SEMICON Taiwan 2026 kicked off international forums August 31 in Taipei and opened its main exhibition September 2 at TaiNEX, drawing more than 100,00...
- TSMC 2027 Capex Seen Reaching $85 Billion As AI Capacity Strain Deepens — Wall Street's most bullish TSMC 2027 capex model now points to $85 billion, up from Goldman Sachs' $78B forecast, as leading-edge AI capacity stays co...
- Apple Reveals M6, Its First 2nm Chip With Dual 16-Core Neural Engine — Apple's M6 debuts on TSMC's 2nm N2 process with a 12-core CPU, 12-core GPU with per-core neural accelerators, and a Dual 16-core Neural Engine for on-...
- Trump Weighs Chip Tariffs On Laptops And AI Servers, Pegging Duty-Free Quota To US Fab Investment — Commerce Secretary Howard Lutnick favors extending semiconductor duties to laptops, gaming consoles and AI servers — with a duty-free quota pegged to...
- Nvidia Q2 FY27: Record $96B Quarter On Blackwell Ultra Ramp — Nvidia posted record fiscal-Q2 2027 revenue of $96.2 billion — up 106% year-over-year — on the ramp of its Blackwell Ultra AI platform, and guided cur...
- Japan Earmarks Another $944M For Rapidus To Race TSMC In 2nm — Japan's Ministry of Economy, Trade and Industry plans to inject a further ¥150 billion — roughly $944 million — into Rapidus in its fiscal 2027 budget...
- Xiaomi Debuts 3nm Xring O3 With LPDDR6, Plus AI and Auto-Driving Chips — Xiaomi's second-generation flagship SoC arrives on TSMC's 3nm N3P with 24 billion transistors, LPDDR6 support and 200 TOPS of AI, alongside a stacked...
- Waymo Reveals Custom 5nm ASIC And Seven-Supplier Stack Behind Its Ojai Robotaxi — Alphabet's Waymo has opened up the boot of its robotaxi, publishing the architecture of its onboard computer, a purpose-built 5-nanometer ASIC that pu...
- TSMC's 1.6nm A16 Node Slated For Q4 2026 Mass Production, Roadmap Holds — TSMC confirmed its 1.6nm-class A16 process is on track for high-volume manufacturing in the fourth quarter of 2026, targeting datacenter AI accelerato...
- Sony and TSMC to invest $6.4 billion in Kumamoto image sensor joint venture — Sony Group and TSMC are in talks to invest a combined $6.4 billion in a Kumamoto image-sensor fab, targeting 2029 production for automotive and roboti...
- Samsung Foundry Hikes 4nm and 5nm Prices Up To 15% As AI Demand Fills Its Lines — Samsung is raising prices on advanced chipmaking by up to 15% as customers cut off from TSMC's booked-out AI capacity turn to Pyeongtaek's SF4 line.
- Cerebras Unveils CS-4, A 3-Wafer AI System Aimed At Inference — Cerebras debuted the CS-4 on Tuesday at its Supernova event — a rack-scale system with three WSE-3 Turbo processors and 750 PFLOPS of AI compute.
- Sony And TSMC Ink $6.4B Image Sensor JV In Kumamoto — Sony Semiconductor Solutions and TSMC signed a definitive agreement to form Advanced Vision Semiconductor Manufacturing Corporation, a ~1 trillion yen...
- Sony And TSMC Plot $6.4B Image-Sensor JV In Kumamoto — Sony and TSMC are in talks to spend a combined ¥1 trillion on a Kumamoto image-sensor plant targeting 2029, feeding Apple iPhones and the next wave of...
- Microsoft Preps Maia 300 AI Chip Reveal, Books 300K TSMC Units — Microsoft is planning a September unveil for its Maia 300 AI accelerator and has booked TSMC capacity for more than 300,000 chips into 2027 as it race...